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This Precision Machined Aluminum Alloy Heat Dissipation Backplane is a high-efficiency thermal management solution tailored for heat-sensitive electronic/industrial equipment — with proven performance in real-world scenarios:
- 5G Base Station RRU Units: For the high-power Remote Radio Unit (RRU) of 5G base stations (which generates continuous heat during high-frequency signal transmission), this backplane effectively transfers heat from the RRU’s power amplifier module. After application, the RRU’s operating temperature dropped from 75℃ to 58℃, and no overheating alarms occurred during 720 hours of continuous operation.
- Industrial PLC Control Cabinet Modules: In workshop high-temperature environments (35℃ ambient temperature), the high-power servo driver module in PLC control cabinets is prone to overheating and downtime. This aluminum backplane stabilizes the module’s core temperature below 60℃, reducing equipment failure rates by 80% during 24/7 operation.
- High-Performance Electronic Devices: For high-end gaming laptop motherboards (equipped with i9 CPUs/RX 7900M GPUs), this backplane acts as an auxiliary heat dissipation component: under full-load “CPU+GPU baking” tests, the CPU temperature decreased by 12℃, avoiding performance throttling and improving frame rate stability by 25%. It also applies to professional drone flight control modules — maintaining the flight control temperature below 45℃ during high-altitude, high-load flights, preventing signal lag caused by overheating.
Crafted from high-purity 6061/6063 aluminum alloy (thermal conductivity ≥180 W/(m·K) + lightweight property), it is produced via precision CNC machining (±0.01mm tolerance) with optional surface anodizing (enhanced corrosion resistance) or sandblasting. Customization of size, thickness, and heat dissipation groove design is supported to match your device’s unique thermal management needs.




